IN74HCT241A

2

Symbol

Parameter

Value

Unit

DC Supply Voltage (Referenced to GND)

-0.5 to +7.0

V

DC Input Voltage (Referenced to GND)

V

DC Output Voltage (Referenced to GND)

V

DC Input Current, per Pin

±20

mA

DC Output Current, per Pin

±35

mA

±75

mA

Power Dissipation in Still Air, Plastic DIP+

SOIC Package+

750

500

mW

Tstg

Storage Temperature

-65 to +150

°C

Lead Temperature, 1 mm from Case for 10

Seconds

(Plastic DIP or SOIC Package)

260

°C

Functional operation should be restricted to the Recommended Operating Conditions.

+Derating - Plastic DIP: - 10 mW/

°C from 65° to 125°C

SOIC Package: : - 7 mW/

°C from 65° to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage (Referenced to GND)

4.5

5.5

V

DC Input Voltage, Output Voltage (Referenced to

GND)

0

V

Operating Temperature, All Package Types

-55

+125

°C

Input Rise and Fall Time (Figure 1)

0

500

ns

This device contains protection circuitry to guard against damage due to high static

voltages or electric fields. However, precautions must be taken to avoid applications of any voltage

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or