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THS4631DRG4 Datasheet(PDF) 2 Page - Texas Instruments

Part # THS4631DRG4
Description  HIGH-VOLTAGE, HIGH SLEW RATE, WIDEBAND FET-INPUT OPERATIONAL AMPLIFIER
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
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THS4631DRG4 Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
PACKAGE DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
THS4631
SLOS451A – DECEMBER 2004 – REVISED MARCH 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
over operating free-air temperature range (unless otherwise noted)(1)
UNITS
VS
Supply voltage, VS– to VS+
33 V
VI
Input voltage
±VS
IO(2)
Output current
150 mA
Continuous power dissipation
See Dissipation Rating Table
TJ
Maximum junction temperature(2)
150°C
TA
Operating free-air temperature, continues operation, long-term reliability(2)
125°C
Tstg
Storage temperature range
65°C to 150°C
Lead temperature
1,6 mm (1/16 inch) from case for 10 seconds
300°C
HBM
1000 V
ESD ratings:
CDM
1500 V
MM
100 V
(1)
The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2)
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
POWER RATING(1) (TJ =125°C)
PACKAGE
θ
JC (°C/W)
θ
JA (°C/W)
TA ≤ 25°C
TA = 85°C
D (8)(2)
38.3
95
1.1 W
0.47 W
DDA (8)
9.2
45.8
2.3 W
0.98 W
DGN (8)
4.7
58.4
2.14 W
1.11 W
(1)
Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance.
(2)
This data was taken using the JEDEC standard High-K test PCB.
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNITS
Dual Supply
±5
±15
VS
Supply Voltage
V
Single Supply
10
30
TA
Operating free-air temperature
-40
85
°C
2


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