ICP-S Technical Manual

Overcurrent Protection Elements

Rev.A

11/13

8. Application Circuit Example

8-1 Recommended Flow Soldering Conditions

8-2 Recommended Reflow Soldering Conditions

8-3 Recommended Copper Pattern on PCB

25

50

100

100

°C

(

°C)

Preheating

Soldering

Manual soldering conditions

Soldering iron temperature: 350

°C max.

Soldering time: 3 seconds max.

Natural cooling

120

°C

2 minutes min.

5 minutes min.

1 minute min.

10 seconds min.

230

°C

260

°C

150

200

250

300

0

50

100

(

°C)

Preheating

speed

A peak temperature of at least 230

°C is recommended. If the peak temperature is less than 230°C, it is recommended to

make some adjustments, such as the retention of the peak temperature and soldering time longer and an increase in the thickness

of solder paste.

1 to 5

°C / sec

Preheating

120 to 160

°C,

50 to 120 sec

Peak temperature

230 to 260

°C, 10sec Max.

Cooling

60sec Min.

∗ Number of reflow times: 2 TIMES Max.

Reflow soldering

(High-temperature

retention time)

200

°C,

30 to 60 sec

Reflow heating temperature

1 to 5

°C / sec

150

200

250

1.6 to 2.0

4.0 to 5.0