Package Type

24DW3

24 Lead, 0.300" Wide, Windowed, Ceramic Dual Inline Package (Cerdip)

24D3

24 Lead, 0.300" Wide, Non-Windowed (OTP), Ceramic Dual Inline Package (Cerdip)

28J

28 Lead, Plastic J-Leaded Chip Carrier OTP (PLCC)

28LW

28 Pad, Windowed, Ceramic Leadless Chip Carrier (LCC)

28L

28 Pad, Non-Windowed, Ceramic Leadless Chip Carrier OTP (LCC)

24P3

24 Lead, 0.300" Wide, Plastic Dual Inline Package OTP (PDIP)

24S

24 Lead, 0.300" Wide, Plastic Gull Wing Small Outline OTP (SOIC)

AT22V10/L

1-107