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ASMC-PAB9-TV3N5 Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard) |
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ASMC-PAB9-TV3N5 Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard) |
5 / 9 page 5 Figure 6a. Recommended Sn-Pb reflow soldering profile. 240 °C MAX. 20 SEC. MAX. 3 °C/SEC. MAX. 120 SEC. MAX. TIME 183 °C 100-150 °C –6 °C/SEC. MAX. 60-150 SEC. 3 °C/SEC. MAX. 217 °C MAX. 120 SEC. 6 °C/SEC. MAX. 3 °C/SEC. MAX. 125 °C ± 25 °C 255 °C 60 to 150 SEC. 10 to 20 SEC. TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. +5 °C -0 °C Figure 6b. Recommended Pb-free reflow soldering profile. LAMINAR WAVE BOTTOM SIDE OF PC BOARD HOT AIR KNIFE TURBULENT WAVE FLUXING PREHEAT 010 20 30 50 100 150 200 250 30 40 50 TIME – SECONDS 60 70 80 90 100 TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 °C (100°C PCB) SOLDER WAVE TEMPERATURE = 245 °C AIR KNIFE AIR TEMPERATURE = 390 °C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 ° SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Figure 7. Recommended wave soldering profile. |
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