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S87C552-4A68 Datasheet(PDF) 6 Page - NXP Semiconductors |
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S87C552-4A68 Datasheet(HTML) 6 Page - NXP Semiconductors |
6 / 20 page Philips Semiconductors Product specification 80C562/83C562 Single-chip 8-bit microcontroller 1992 Jan 08 6 OSCILLATOR CHARACTERISTICS XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier. The pins can be configured for use as an on-chip oscillator, as shown in the logic symbol. To drive the device from an external clock source, XTAL1 should be driven while XTAL2 is left unconnected. There are no requirements on the duty cycle of the external clock signal, because the input to the internal clock circuitry is through a divide-by-two flip-flop. However, minimum and maximum high and low times specified in the data sheet must be observed. RESET A reset is accomplished by holding the RST pin high for at least two machine cycles (24 oscillator periods), while the oscillator is running. To ensure a good power-on reset, the RST pin must be high long enough to allow the oscillator time to start up (normally a few milliseconds) plus two machine cycles. At power-on, the voltage on VDD and RST must come up at the same time for a proper start-up. IDLE MODE In the idle mode, the CPU puts itself to sleep while all of the on-chip peripherals stay active. The instruction to invoke the idle mode is the last instruction executed in the normal operating mode before the idle mode is activated. The CPU contents, the on-chip RAM, and all of the special function registers remain intact during this mode. The idle mode can be terminated either by any enabled interrupt (at which time the process is picked up at the interrupt service routine and continued), or by a hardware reset which starts the processor in the same manner as a power-on reset. POWER-DOWN MODE In the power-down mode, the oscillator is stopped and the instruction to invoke power-down is the last instruction executed. Only the contents of the on-chip RAM are preserved. A hardware reset is the only way to terminate the power-down mode. the control bits for the reduced power modes are in the special function register PCON. Table 1 shows the state of the I/O ports during low current operating modes. Table 1. External Pin Status During Idle and Power-Down Modes MODE PROGRAM MEMORY ALE PSEN PORT 0 PORT 1 PORT 2 PORT 3 PORT 4 PWM0/ PWM1 Idle Internal 1 1 Data Data Data Data Data High Idle External 1 1 Float Data Address Data Data High Power-down Internal 0 0 Data Data Data Data Data High Power-down External 0 0 Float Data Data Data Data High ABSOLUTE MAXIMUM RATINGS1, 2, 3 PARAMETER RATING UNIT Voltage on any other pin to VSS –0.5 to +6.5 V Input, output DC current on any single I/O pin 5.0 mA Power dissipation (based on package heat transfer limitations, not device power consumption) 1.0 W Storage temperature range –65 to +150 °C NOTES: 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section of this specification is not implied. 2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. 3. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. |
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