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NS32829 Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # NS32829
Description  1 Megabit High Speed Dynamic RAM Controller/Drivers
Download  26 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

NS32829 Datasheet(HTML) 5 Page - National Semiconductor (TI)

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DP8428 vs DP8429
The DP8428 DYNAMIC RAM CONTROLLERDRIVER is
identical to the DP8429 with the exception of two functional
differences incorporated to improve performance with 32-bit
microprocessors
1) Pin 28 (B1) is used to enabledisable a pair of RAS out-
puts and pin 29 (B0 on the DP8429) is a no connect
When B1 is low RAS0 and RAS1 are enabled such that
they both go low during an access When B1 is high
RAS2 and RAS3 are enabled This feature is useful when
driving words of 32 bits or more since each RAS would
be driving only one half of the word By distributing the
load on each RAS line in this way the DP8428 will meet
the same AC specifications driving 2 banks of 32 DRAMs
each as the DP8429 does driving 4 banks of 16 bits each
2) The hidden refresh function available on the DP8429 has
been disabled on the DP8428 in order to reduce the
amount of setup time necessary from CS going low to
RASIN going low during an access of DRAM This param-
eter called tCSRL1 is 5 ns for the DP8428 whereas it is
34 ns for the DP8429 The hidden refresh function al-
lowed only a very small increase in system performance
at microprocessor frequencies of 10 MHz and above
Pin Definitions
VCC GND GND b VCC e 5V g10% The three supply
pins have been assigned to the center of the package to
reduce voltage drops both DC and AC There are two
ground pins to reduce the low level noise The second
ground pin is located two pins from VCC so that decoupling
capacitors can be inserted directly next to these pins It is
important to adequately decouple this device due to the
high switching currents that will occur when all 10 address
bits change in the same direction simultaneously A recom-
mended solution would be a 1 mF multilayer ceramic capaci-
tor in parallel with a low-voltage tantalum capacitor both
connected as close as possible to GND and VCC to reduce
lead inductance See Figure below
TLF8649 – 8
Capacitor values should be chosen depending on the particular application
R0 – R9 Row Address Inputs
C0 – C9 Column Address Inputs
Q0 – Q9 Multiplexed Address Outputs –
This address is
selected from the Row Address Input Latch the Column
Address Input Latch or the Refresh Counter
RASIN Row Address Strobe Input –
RASIN directly con-
trols the selected RAS output when in an access mode and
all RAS outputs during hidden or external refresh
RC (RFCK) –
In the auto-modes this pin is the external
refresh clock input one refresh cycle should be performed
each clock period In the external access mode it is Row
Column Select Input which enables either the row or column
address input latch onto the output bus
CASIN (RGCK) –
In the auto-modes this pin is the RAS
Generator Clock input In external access mode it is the
Column Address Strobe input which controls CAS directly
once columns are enabled on the address outputs
ADS Address (Latch) Strobe Input –
Row Address Col-
umn Address and Bank Select Latches are fall-through with
ADS high latching occurs on high-to-low transition of ADS
CS Chip Select Input –
When high CS disables all ac-
cesses Refreshing however in both modes 0 and 1 is not
affected by this pin
M0 M2 (RFSH) Mode Control Inputs –
These pins select
one of the four available operational modes of the DP8429
(see Table III)
RFI0 Refresh InputOutput –
In the auto-modes this pin
is the Refresh Request Output It goes low following RFCK
indicating that no hidden refresh was performed while RFCK
was high When this pin is set low by an external gate the
on-chip refresh counter is reset to all zeroes
WIN Write Enable Input
WE Write Enable Output –
WE follows WIN unconditionally
RAHS Row Address Hold Time Select –
Selects the
tRAH to be guaranteed by the DP8428 or DP8429 delay line
to allow for the use of fast or slow DRAMs
CAS Column Address Strobe Output –
In mode 5 and in
mode 4 with CASIN low before RC goes low CAS goes
low automatically after the column address is valid on the
address outputs In mode 4 CAS follows CASIN directly af-
ter RC goes low allowing for nibble accessing CAS is al-
ways high during refresh
RAS 0 – 3 Row Address Strobe Outputs –
The enabled
RAS output (see Table II) follows RASIN directly during an
access During refresh all RAS outputs are enabled
5


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