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MC10LVEP16DT Datasheet(PDF) 2 Page - ON Semiconductor |
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MC10LVEP16DT Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 10 page MC10LVEP16, MC100LVEP16 http://onsemi.com 2 1 2 3 45 6 7 8 Q VEE VCC D Q D VBB NC Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 1. PIN DESCRIPTION Pin Function D*, D** ECL Data Inputs Q, Q ECL Data Outputs VBB Ref. Voltage Output VCC Positive Supply VEE Negative Supply NC No Connect * Pins will default LOW when left open. **Pins will default to VCC/2 when left open. Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor 37.5 kW ESD Protection Human Body Model Machine Model Charged Device Model > 4 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 167 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V VI v VCC VI w VEE 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W Tsol Wave Solder <2 to 3 sec @ 248°C 265 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. |
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