UCC2541

SLUS621A − AUGUST 2004 − SEPTEMBER 2005

3

www.ti.com

ORDERING INFORMATION

TA = TJ

HTSSOP−20 (PWP)(1)

QFN−32 (RHB)(1)

TA = TJ

Bulk

Bulk

−40

°C to +105°C

UCC2541PWP

UCC2541RHB

(1) The PWP and RHB packages are also available at 73 devices per tube and taped and reeled at

3,000 devices per reel. Add an R suffix to the device type (i.e., UCC2541PWPR). See

the application section of the data sheet for PowerPAD drawing and layout information.

CONNECTION DIAGRAM

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

RSET

REF

G2C

SYNCIN

RAMP

GND

VEA−

CEA−

COMP

TR

SWS

BST

G1

SW

VDD

PGND

G2

VDRV

G2S

SS

PWP PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

RSET

VREF

G2C

SYNCIN

RAMP

GND

VEA−

CEA−

G1

G1

SW

VDD

PGND

PGND

G2

G2

RHB PACKAGE

(TOP VIEW)

NC − No internal connection

NOTE: The PowerPAD

t is not directly connected to any lead of the package, but is thermally connected to the substrate of the device. The

exposed dimension is 1.3 mm x 1.7 mm for the PWP package and 3.25 mm x 3.25 mm for the RHB package. However, the tolerances

can be +1.05 mm / −0.05 mm (+41 mils / −2 mils) due to position and mold flow variation.

THERMAL INFORMATION

PACKAGE

FAMILY

PACKAGE

DESIGNATOR

θJA (°C/W)

(with PowerPAD)

θJC (°C/W)

(without PowerPAD)

θJC (°C/W)

(with PowerPAD)

MAXIMUM DIE

TEMPERATURE

PowerPAD



HTSSOP−20

PWP

22.3 to 32.6

(500 to 0 LFM)

19.9

1.4

125

°C

Quad Flatpack

QFN−32

RHB

22.3 to 32.6

(500 to 0 LFM)

19.9

1.4

125

°C