Data Sheet S15818EJ1V0DS

10

µµµµPD16705

7. RECOMMENDED MOUNTING CONDITIONS

The following conditions must be met for mounting conditions of the

µPD16705.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under

different conditions.

µPD16705N-xxx: TCP (TAB Package)

Mounting Condition

Mounting Method

Condition

Thermocompression

Soldering

Heating tool 300 to 350

°C, heating for 2 to 3 seconds, pressure 100g (per

solder)

ACF

(Adhesive

Conductive Film)

Temporary bonding 70 to 100

Real bonding 165 to 180

(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo

Bakelite, Ltd).

Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more mounting methods at a time.