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UPD16705 Datasheet(PDF) 10 Page - NEC |
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UPD16705 Datasheet(HTML) 10 Page - NEC |
10 / 12 page Data Sheet S15818EJ1V0DS 10 µµµµPD16705 7. RECOMMENDED MOUNTING CONDITIONS The following conditions must be met for mounting conditions of the µPD16705. For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E). Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under different conditions. µPD16705N-xxx: TCP (TAB Package) Mounting Condition Mounting Method Condition Thermocompression Soldering Heating tool 300 to 350 °C, heating for 2 to 3 seconds, pressure 100g (per solder) ACF (Adhesive Conductive Film) Temporary bonding 70 to 100 °C, pressure 3 to 8 kg/cm2, time 3 to 5 sec. Real bonding 165 to 180 °C, pressure 25 to 45 kg/cm2, time 30 to 40 sec. (When using the anisotropy conductive film SUMIZAC1003 of Sumitomo Bakelite, Ltd). Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF manufacturing company. Be sure to avoid using two or more mounting methods at a time. |
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Similar Description - UPD16705 |
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