MC74LVXT4051

http://onsemi.com

3

MAXIMUM RATINGS (Note 1)

Symbol

Parameter

Value

Unit

Negative DC Supply Voltage

(Referenced to GND)

V

Positive DC Supply Voltage

(Referenced to GND)

V

Analog Input Voltage

V

Digital Input Voltage

(Referenced to GND)

V

I

DC Current, Into or Out of Any Pin

$20

mA

Storage Temperature Range

_C

Lead Temperature, 1 mm from Case for 10 Seconds

260

_C

Junction Temperature under Bias

)150

_C

Thermal Resistance

SOIC

TSSOP

143

164

°C/W

Power Dissipation in Still Air,

SOIC

TSSOP

500

450

mW

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 30% – 35%

UL–94–VO (0.125 in)

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

u2000

u200

u1000

V

Latch–Up Performance

$300

mA

1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these

conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated

conditions is not implied.

2. Tested to EIA/JESD22–A114–A.

3. Tested to EIA/JESD22–A115–A.

4. Tested to JESD22–C101–A.

5. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

Negative DC Supply Voltage

(Referenced to GND)

GND

V

Positive DC Supply Voltage

(Referenced to GND)

2.5

2.5

6.0

6.0

V

Analog Input Voltage

V

Digital Input Voltage

(Note 6) (Referenced to GND)

0

6.0

V

Operating Temperature Range, All Package Types

125

_C

Input Rise/Fall Time

(Channel Select or Enable Inputs)

0

0

100

20

ns/V

6. Unused inputs may not be left open. All inputs must be tied to a high–logic voltage level or a low–logic input voltage level.

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 3. Failure Rate vs. Time Junction Temperature

TIME, YEARS