MPXV7002

Sensors

Freescale Semiconductor

3

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

Figure 2 illustrates the Differential or Gauge configuration

in the basic chip carrier (Case 482). A gel die coat isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MPXV7002 series pressure sensor operating

characteristics, and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media,

other than dry air, may have adverse effects on sensor

performance and long-term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 3 shows the recommended decoupling circuit for

interfacing the integrated sensor to the A/D input of a

microprocessor or microcontroller. Proper decoupling of the

power supply is recommended.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

10

° to 60°C using the decoupling circuit shown in Figure 3.

The output will saturate outside of the specified pressure

range.

Figure 2. Cross-Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering

(For additional output filtering, please refer to

Application Note AN1646.)

Figure 4. Output versus Pressure Differential

Fluoro Silicone

Gel Die Coat

Wire Bond

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Differential Sensing

Element

P2

+5 V

1.0

µF

0.01

µF

470 pF

GND

IPS

OUTPUT

Lead

Frame

Differential Pressure (kPa)

5.0

4.0

3.0

2.0

1.0

0

02

TYPICAL

MIN

-2

-1

1

Transfer Function:

MAX