MMG3013NT1 datasheet(10/12 Pages) FREESCALE

Part #	MMG3013NT1

Description	Heterojunction Bipolar Transistor Technology (InGaP HBT)

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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10

RF Device Data

Freescale Semiconductor

MMG3013NT1

1.7

5.33

3.48

0.58

1.27

0.86

3.86

0.64

7.62

2.49

2.54

1.27

0.305 diameter

Figure 20. Recommended Mounting Configuration

NOTES:

1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE

USED IN PCB LAYOUT DESIGN.

2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS

POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.

3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN

AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO

THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL

AND RF PERFORMANCE.

4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM

PITCH.

Recommended Solder Stencil

Similar Part No. - MMG3013NT1

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