P-CHANNEL

POWER MOSFET

Drain-Source Breakdown Voltage

Breakdown Voltage Temp. Coeff.

Gate Threshold Voltage

Gate-Source Leakage , Forward

Gate-Source Leakage , Reverse

Characteristic

Symbol

Max. Units

Typ.

Min.

Test Condition

Static Drain-Source

On-State Resistance

Forward Transconductance

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Total Gate Charge

Gate-Source Charge

Gate-Drain( “Miller “ ) Charge

g

fs

C

iss

C

oss

C

rss

t

d(on)

t

r

t

d(off)

t

f

Q

g

Q

gs

Q

gd

BV

DSS

∆BV/∆T

J

V

GS(th)

R

DS(on)

I

GSS

I

DSS

V

V/

V

nA

µA

Ω

Ω

pF

ns

nC

--

--

--

--

--

--

--

--

--

--

--

--

--

V

I

See Fig 7

V

V

V

V

V

V

V

V

R

See Fig 13

V

I

See Fig 6 & Fig 12

Drain-to-Source Leakage Current

V

See Fig 5

Source-Drain Diode Ratings and Characteristics

Continuous Source Current

Pulsed-Source Current

Diode Forward Voltage

Reverse Recovery Time

Reverse Recovery Charge

I

S

I

SM

V

SD

t

rr

Q

rr

Characteristic

Symbol

Max. Units

Typ.

Min.

Test Condition

--

--

--

--

--

A

V

ns

µC

Integral reverse pn-diode

in the MOSFET

T

T

di

O

4

O

4

O

5

O

4

O

4

O

5

O

1

O

4

O

4

SFW/I9634

-250

--

-2.0

--

--

--

--

--

-0.22

--

--

--

--

--

110

45

13

20

40

16

29

5.4

15.5

--

--

-4.0

-100

100

-10

-100

1.3

--

975

165

65

35

50

90

40

37

--

--

3.6

750

--

--

--

170

1.17

-5.0

-20

-5.0

--

--

Notes ;

Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature

L=20mH, I

I

SD

-5.0A, di/dt

400A/

µs, V

DD

BV

Pulse Test : Pulse Width = 250

µs, Duty Cycle

2%

Essentially Independent of Operating Temperature

<

_

<

_

<

_

<

_

O

1

O

2

O

3

O

4

O

5