Analog Integrated Circuit Device Data

Freescale Semiconductor

7

MMA7261Q

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package.

With the correct footprint, the packages will self-align when

subjected to a solder reflow process. It is always

recommended to design boards with a solder mask layer to

avoid bridging and shorting between solder pads.

PACKAGE DIMENSIONS

For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.

Solder areas

Pin 1 ID (non metallic)

9

12

4.25

6.0

14

1.00

0.55

NOTES:

1.

2.

3.

4.

5.

6.

7.

ALL DIMENSIONS ARE IN MILLIMETERS.

INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

THIS DIMENSION APPLIES TO METALLIZED

TERMINAL AND IS MEASURED BETWEEN 0.25MM

AND 0.30MM FROM TERMINAL TIP.

THIS DIMENSION REPRESENTS TERMINAL FULL

BACK FROM PACKAGE EDGE UP TO 0.1MM IS

ACCEPTABLE.

COPLANARITY APPLIES TO THE EXPOSED HEAT

SLUG AS WELL AS THE TERMINAL.

RADIUS ON TERMINAL IS OPTIONAL.

MINIMUM METAL GAP 0.2MM.

(45˚)

16X

0.1

4

DETAIL M

PIN 1

INDEX AREA

6

B

C

0.10

2X

2X

C

0.10

A

6

M

M

(0.203)

C

0.1

C

0.08

5

DETAIL G

VIEW ROTATED 90˚ CLOCKWISE

(1)

(0.5)

(0.102)

1.45±0.1

EXPOSED DIE

ATTACH PAD

13

4

1

16

12X

9

12

85

M

0.1

C

M

0.05

C

A B

0.43

C

0.1

A B

VIEW M-M

DETAIL M

PIN 1 INDEX

DETAIL G

C

0.1

A B

16X

0.60

0.40

1

4.24

4.04

4.24

4.04

0.5

3

98ASA10651D

ISSUE O

16-LEAD QFN