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Low Power CMOS SRAM
64K X 16
UC62LV1024
-55/-70
PACKAGE DIMENSIONS
θ
TSOPII - 44
44
23
22
1
D
e
b
Seating Plane "y"
UNIT
SYMBOL
INCH
MM
A1
0.004±0.002
0.1±0.05
A
0.0433±0.004
1.10±0.1
A2
0.039±0.002
1.00±0.05
b
0.012 ~ 0.018
0.3 ~ 0.45
c
0.005 ~ 0.008
0.12 ~ 0.21
b1
0.012 ~ 0.016
0.3 ~ 0.4
D
0.725±0.004
18.41±0.1
c1
0.005 ~ 0.006
0.12 ~ 0.16
E1
0.463±0.008
11.76±0.20
E
0.400±0.004
10.16±0.1
e
0.0315±0.004
0.80±0.10
L1
0.0197±0.004
0.80±0.1
L
0.0197±0.004
0.50±0.1
0° ~ 8°
0° ~ 8°
y
0.004 Max.
0.1 Max.
θ
DETAIL "A" (2:1)
"A"
A
A
L
L1
b
WITH PLATING
c1
c
b1
SECTION A-A
BASE METAL
D1
D ± 0.1
Fig. A
S o ld er B a ll d ia m eter = 0 .3 5 ± 0.05
Fig . A
B all p itch e= 0 .7 5
D
E
D1
E 1
8.0
6.0
5 .25
3 .75
Sid e V iew
TO P V iew
48 M in i-B G A 6*8m m
U-Chip Technology Corp. LTD.
Preliminary
Rev. 1.0
Reserves the right to modify document contents without notice.
PAGE
9
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