PD -2.472 rev. B 01/99

• Reduced RFI and EMI

• Reduced Snubbing

• Extensive Characterization of

Recovery Parameters

Features

Description

HEXFRED

power conditioning systems. An extensive characterization of the recovery

behavior for different values of current, temperature and di/dt simplifies the

calculations of losses in the operating conditions. The softness of the recovery

eliminates the need for a snubber in most applications. These devices are ideally

suited for power converters, motors drives and other applications where

switching losses are significant portion of the total losses.

Ultrafast, Soft Recovery Diode

HEXFRED

TM

HFA80NC40CSL

SLD -61-8

Absolute Maximum Ratings (per Leg)

Note:

 Limited by junction temperature

ƒ 125°C

Thermal - Mechanical Characteristics

Parameter

Min.

Typ.

Max.

Units

Junction-to-Case, Single Leg Conducting

––––

––––

0.85

Junction-to-Case, Both Legs Conducting

––––

––––

0.42

Wt

Weight

––––

4.3 (0.15)

––––

g (oz)

°C/W

K/W

W

Parameter

Max.

Units

Cathode-to-Anode Voltage

400

V

Continuous Forward Current

85

Continuous Forward Current

42

A

Single Pulse Forward Current



300

Non-Repetitive Avalanche Energy

‚

1.4

mJ

Maximum Power Dissipation

150

Maximum Power Dissipation

59

Operating Junction and

Storage Temperature Range

Soldering Temperature, for 10 sec.

300 (0.063 in. (1.6mm) from case)

-55 to +150

°C

1