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ML63189B Datasheet(PDF) 11 Page - OKI electronic componets |
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ML63189B Datasheet(HTML) 11 Page - OKI electronic componets |
11 / 36 page FEDL63187B-06 1Semiconductor ML63187B/63189B 11/36 PAD CONFIGURATION (ML63189B) Pad Layout Chip size : 4.81 mm × 5.20 mm Chip thickness : 350 µm (280 µm: available as required) Coordinate origin : center of chip Pad hole size : 100 µm × 100 µm Pad size : 110 µm × 110 µm Minimum pad pitch : 140 µm Note: The chip substrate voltage is V SS. 31 SEG32 SEG1 123 32 SEG33 SEG0 122 33 SEG34 COM8 121 34 SEG35 COM7 120 35 SEG36 COM6 119 36 SEG37 COM5 118 37 SEG38 COM4 117 38 SEG39 COM3 116 39 SEG40 COM2 115 40 SEG41 COM1 114 41 SEG42 P0.3 113 42 SEG43 P0.2 112 43 SEG44 P0.1 111 44 SEG45 P0.0 110 45 SEG46 P9.3 109 46 SEG47 P9.2 108 47 SEG48 P9.1 107 48 SEG49 P9.0 106 49 SEG50 PA.3 105 50 SEG51 PA.2 104 51 SEG52 PA.1 103 52 SEG53 PA.0 102 53 SEG54 PB.3 101 54 SEG55 PB.2 100 55 SEG56 PB.1 99 56 SEG57 PB.0 98 57 SEG58 PE.3 97 58 SEG59 PE.2 96 59 SEG60 PE.1 95 60 SEG61 PE.0 94 61 SEG62 62 SEG63 V DDI 93 ML63189B Y X (0,0) |
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