FEDR26V51253L-02-02

OKI Semiconductor

MR26V51253L / P2ROM

6/8

PACKAGE DIMENSIONS

P-SSOP70-500-0.80-K-MC

Package material

Epoxy resin

Lead frame material

42 alloy

Pin treatment

Solder plating (

≥5µm)

Package weight (g)

2.15 TYP.

5

Rev. No./Last Revised

1/Nov. 13, 2002

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in

storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,

package name, pin number, package code and desired mounting conditions (reflow method, temperature and

times).

(Unit: mm)