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MR27T802F Datasheet(PDF) 8 Page - OKI electronic componets |
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MR27T802F Datasheet(HTML) 8 Page - OKI electronic componets |
8 / 10 page FEDR27T802F-02-05 OKI Semiconductor MR27T802F / P2ROM 8/10 TSOP(2)44-P-400-0.80-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating ( ≥5µm) Package weight (g) 0.54 TYP. 5 Rev. No./Last Revised 3/Dec. 10, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm) |
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