6

www.protekdevices.com

05156.R5 4/05

P0408FC3.3C*

thru

P0408FC36C*

*U.S. Patent No. Des. “D456,367S”

PACKAGE OUTLINE & DIMENSIONS

COPYRIGHT © ProTek Devices 2005

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical

characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that

the final judgement concerning selection and specifications is the buyer’s and that in furnishing

engineering and technical assistance, ProTek assumes no responsibility with respect to the

selection or specifications of such products.

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288

A

F

G

H

I

0.51

0.15 SQ

0.71

0.99

0.51

0.020

0.006 SQ

0.028

0.039

0.020

DIM

MILLIMETERS

INCHES

PACKAGE DIMENSIONS

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and

outline: .xxx ± 0.05mm (± 0.002”).

3.

Preferred: Using 0.1mm (0.004”) stencil.

MOUNTING PAD LAYOUT - Option 2

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and

reeled in accordance with EIA 481.

2.

8mm Plastic Tape: 7 Inch Reels - 5,000

pieces per reel. Ordering Suffix: -T75-1

(i.e., P0408FC05C-T75-1).

3.

8mm Paper Tape: 7 Inch Reels - 5,000

pieces per reel. Ordering Suffix: -T75-2

(i.e., P0408FC05C-T75-2).

4. Suffix = LF = Lead-Free,

i.e.,

P0408FC05C-LF-T75-1.

Outline & Dimensions: Rev 4 - 2/04, 06021

TAPE & REEL ORIENTATION

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

Quad Die - 0408

COPPER CONTACT 0.009” [0.23] DIA.

SOLDER PRINT 0.014” [0.36] DIA.

A

I

SOLDER

MASK

DIE

SOLDER

BUMP