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BZT52H-C6V8 Datasheet(PDF) 7 Page - NXP Semiconductors |
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BZT52H-C6V8 Datasheet(HTML) 7 Page - NXP Semiconductors |
7 / 10 page 9397 750 15082 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 22 December 2005 7 of 10 Philips Semiconductors BZT52H series Single Zener diodes in a SOD123F package 8. Package outline 9. Packing information [1] For further information and the availability of packing methods, see Section 16. 10. Soldering Fig 5. Package outline SOD123F 04-11-29 Dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 Table 11: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity 3000 10000 BZT52H-C2V4 to BZT52H-C75 SOD123F 4 mm pitch, 8 mm tape and reel -115 -135 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste |
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