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AOT402L Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors

Part # AOT402L
Description  N-Channel Enhancement Mode Field Effect Transistor
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Manufacturer  AOSMD [Alpha & Omega Semiconductors]
Direct Link  http://www.aosmd.com
Logo AOSMD - Alpha & Omega Semiconductors

AOT402L Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors

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background image
AOT402
Symbol
Min
Typ
Max
Units
BVDSS
105
V
1
TJ=55°C
5
IGSS
100
nA
VGS(th)
2
3.3
4
V
ID(ON)
200
A
6.9
8.6
TJ=125°C
12.8
15
7.9
10
m
gFS
88
S
VSD
0.7
1
V
IS
110
A
Ciss
7.7
10
nF
Coss
820
pF
Crss
300
pF
Rg
1.25
2
Qg(10V)
182
230
nC
Qgs
54
nC
Qgd
44
nC
tD(on)
30.5
ns
tr
42.5
ns
tD(off)
66
ns
tf
16
ns
trr
86
115
ns
Qrr
375
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Time
Drain-Source Breakdown Voltage
On state drain current
ID=10mA, VGS=0V
VGS=10V, VDS=5V
VGS=10V, ID=30A
Reverse Transfer Capacitance
IF=30A, dI/dt=100A/µs
VGS=0V, VDS=25V, f=1MHz
SWITCHING PARAMETERS
Electrical Characteristics (TJ=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter
Conditions
IDSS
µA
Gate Threshold Voltage
VDS=VGS, ID=250µA
VDS=84V, VGS=0V
VDS=0V, VGS=±25V
Zero Gate Voltage Drain Current
Gate-Body leakage current
RDS(ON)
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
m
VGS=6V, ID=30A
IS=1A, VGS=0V
VDS=5V, ID=30A
Gate resistance
VGS=0V, VDS=0V, f=1MHz
Turn-Off Fall Time
Total Gate Charge
VGS=10V, VDS=25V, ID=30A
Gate Source Charge
Gate Drain Charge
Body Diode Reverse Recovery Charge IF=30A, dI/dt=100A/µs
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
Turn-Off DelayTime
VGS=10V, VDS=25V, RL=0.75Ω,
RGEN=3Ω
A: The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300
µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=175°C.
G. The maximum current rating is limited by bond-wires.
Rev0: Sept. 2005
Alpha & Omega Semiconductor, Ltd.


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