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HB28E016BP2 Datasheet(PDF) 2 Page - Hitachi Semiconductor

Part # HB28E016BP2
Description  Mobile Embedded Flash with MultiMediaCard-TM Interface 16 Mbyte/32 Mbyte
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Manufacturer  HITACHI [Hitachi Semiconductor]
Direct Link  http://www.renesas.com/eng
Logo HITACHI - Hitachi Semiconductor

HB28E016BP2 Datasheet(HTML) 2 Page - Hitachi Semiconductor

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HB28E016/D032BP2
2
• MultiMediaCard system standard compatibility
 System specification version 3.1 compliant
 SPI mode supports the single and multiple block read and write operations.
 Block and partial block read supported (Command classes 2)
 Stream read supported (Command class 1)
 Block write and erase supported (Command classes 4 and 5)
 Group write protection (Command classes 6)
 Stream write supported (Command classes 3)
 Password data access protection
 Small erase block size of 512 bytes, tagged erase supported
 Read block size programmable between 1 and 2048 bytes
 V
CC = 2.7 V to 3.6 V operation voltage range (VCC = 2.0 V to 3.6 V for the interface)
 No external programming voltage required
 4kV ESD protection (Contact Pads)
• High speed serial interface with random access
 Read speed: sustained: 13.7 Mbit/s (multi-block read)
burst (one block): 20 Mbit/s
 Write speed: sustained: 6.4 Mbit/s (multi-block write)
burst (one block): 20 Mbit/s
 Up to 10 stacked card (at 20 MHz, V
CC = 2.7 to 3.6V)
 Access time: 300 µs (typ) (at 20 MHz, V
CC = 2.7 to 3.6V)
• Low power dissipation
 High speed: 216 mW (max) (at 20 MHz, V
CC = 3.6 V)
• Compact package for mobile phone and etc.
 9 mm × 11 mm × 1.4 mm (max) 71-bump 0.8 mm ball pitch FBGA (BP-71AV)
 10 mm × 11 mm × 1.4 mm (max) 71-bump 0.8 mm ball pitch FBGA (BP-71V)


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