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8A40 Datasheet(PDF) 1 Page - DAESAN ELECTRONIC CORP. |
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8A40 Datasheet(HTML) 1 Page - DAESAN ELECTRONIC CORP. |
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1 / 1 page 8A05 THRU 8A100 Features Mechanical Data · The plastic package carries Underwrites Laboratory Flammability Classification 94V-0 · High forward current capability · High surge current capability · Construction utilizes void-free molded plastic technique · High temperature soldering guaranteed : 250℃/10 seconds, 0.375"(9.5mm) lead length, 5 lbs, (2.3kg) tension Maximum Ratings And Electrical Characteristics · Case : P-6 molded plastic body · Terminals : Lead solderable per MIL-STD-750, method 2026 · Polarity : Color band denotes cathode end · Mounting Position : Any · Weight : 0.07 ounce, 2.1 grams (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Notes: (1) Measured at 1MHz and applied reverse voltage of 4.0V DC. (2) Thermal resistance from junction to ambient and from junction to lead at 0.375"(9.5mm) lead length, P.C.B. mounted with 1.1×1.1"(30×30mm) copper pads. CURRENT 8.0 Amperes VOLTAGE 50 to 1000 Volts Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Volts Peak forward surge current 8.3ms half sine wave superimposed on rated load (JEDEC method) VDC Maximum average forward rectified current 0.375"(9.5mm) lead length TA=60℃ Maximum instantaneous forward voltage at 8.0A VRRM Volts Symbols Units 1.1 VF VRMS 8.0 Amps 400.0 IFSM TJ TSTG 100.0 -50 to +175 ℃ Volts Amps Maximum reverse current at rated voltage Typical thermal resistance (Note 2) Typical junction capacitance (Note 1) Operating and storage temperature range 50 8A05 35 50 10.0 20.0 4.0 Volts μA ℃/W pF I(AV) IR RθJL RθJA TA=25℃ TA=100℃ 150 CJ 100 8A10 70 100 200 8A20 140 200 400 8A40 280 400 600 8A60 420 600 800 8A80 560 800 1000 8A100 700 1000 Dimensions in inches and (millimeters) P-6 1.0(25.4) MIN. 1.0(25.4) MIN. 0.360(9.1) 0.340(8.6) 0.052(1.3) 0.048(1.2) DIA. 0.360(9.1) 0.340(8.6) DIA. |
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