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ISO130UB Datasheet(PDF) 4 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
Part # ISO130UB
Description  High IMR, Low Cost ISOLATION AMPLIFIER
Download  11 Pages
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Manufacturer  BURR-BROWN [Burr-Brown (TI)]
Direct Link  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

ISO130UB Datasheet(HTML) 4 Page - Burr-Brown (TI)

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®
ISO130
4
PIN CONFIGURATION
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ABSOLUTE MAXIMUM RATINGS
Supply Voltages: V
S1, VS2 ......................................................... 0V to 5.5V
Steady-State Input Voltage .......................................... –2V to V
S1 + 0.5V
2 Second Transient Input Voltage ................................................... –6.0V
Output Voltages: V
OUT+, VOUT– ................................... –0.5V to VS2 + 0.5V
Lead Temperature Solder (1.6mm below seating plane, 10s) ....... 260
°C
PACKAGE INFORMATION(1)
PACKAGE DRAWING
MODEL
PACKAGE
NUMBER
ISO130P
8-Pin Plastic DIP
006-3
ISO130PB
8-Pin Plastic DIP
006-3
ISO130U
8-Pin Gull-Wing Plastic Surface Mount
006-2
ISO130UB
8-Pin Gull-Wing Plastic Surface Mount
006-2
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
Top View
8-Pin DIP/SOIC
1
2
3
4
V
S1
V
IN+
V
IN
GND
1
8
7
6
5
V
S2
V
OUT +
V
OUT
GND
2
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
GAIN ERROR
MODEL
PACKAGE
(MAX)
ISO130P
8-Pin Plastic DIP
±5% (mean value = 8.00)
ISO130PB
8-Pin Plastic DIP
±1% (mean value = 7.93)
ISO130U
8-Pin Gull-Wing Plastic Surface Mount
±5% (mean value = 8.00)
ISO130UB
8-Pin Gull-Wing Plastic Surface Mount
±1% (mean value = 7.93)


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