Everlight Electronics Co., Ltd.

http:\\www.everlight.com

Rev 1.0

Page: 7 of 10

Device No：DTT-011-115

Prepared date：03-17-2003

Prepared by：Jaine Tsai

PT11-21B/L41/TR8

Soldering heat reliability(DIP)

Please refer to the following figure

Soldering Iron

Basic spec is ≦5 sec when 260℃. If temperature is higher , time should be shorter

(+10℃

-1sec ).Power dissipation of Iron should be smaller than 15W ,and

temperature should be controllable. Surface temperature of the device should be

under 230℃.

Rework

1.Customer must finish rework within 5 sec under 245℃

2.The head of iron can not touch copper foil.

3.Twin-head type is preferred.