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K7D321874A-HGC37 Datasheet(PDF) 2 Page - Samsung semiconductor |
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K7D321874A-HGC37 Datasheet(HTML) 2 Page - Samsung semiconductor |
2 / 19 page Rev 1.4 1Mx36 & 2Mx18 SRAM - 2 - Oct. 2005 K7D321874A K7D323674A Document Title 32M DDR SYNCHRONOUS SRAM Revision History The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters. Rev No. Rev. 0.0 Rev. 0.1 Rev 0.2 Remark Advance Advance Advance History Initial document. Remove /G operation thru the Spec. - Remove /G from PUNCTIONAL BLOCK DIAGRAM, PIN CONFIGURA- TION, TRUTH TABLE and TIMING WAVEFORMs Add 300MHz Speed bin. - Add Part ID at ORDERING INFORMATION & IDD30 at DC CHARACTERIS- TICS Change ILI and ILo at DC CHARCATERISTICS - ILI : MIN -1 -> -3, MAX 1 -> 3, ILo : MIN -1 -> -5, MAX 1 -> 5 Change the comment of Programmable Impedance Output Driver. Change RECOMMENDED DC OPERATING CONDITIONS. - VREF : Min 0.68 -> 0.65, Max 1.0 -> 0.85 Change PIN CAPACITANCE : CIN : 3 -> 3.1 Change AC TEST CONDITIONS : TR/RF: 0.4/0.4 -> 0.5/0.5 Change AC TIMING CHARACTERISTICS - tCHCL : tKHKL -0.1 -> tKHKL -0.2 , tCLCH : tKLKH -0.1 -> tKLKH -0.2 - tCXCV : 2.10 -> 2.30 Change VDDQ RANGE - In FEATURES : 1.5V VDDQ -> 1.5~.1.8V VDDQ - In RECOMENDED DC OPERATING CONDITIONS : Max VDDQ : 1.6 -> 1.9 Change TRUTH TABLE : Remove Clock Stop Change DC CHARACTERISTICS - x36 IDD : IDD50 : 950 -> 1050, IDD45 : 850 -> 950, IDD40: 800 -> 860, IDD30: 750 -> 760 - x18 IDD: IDD50 : 850 -> 1000, IDD45 : 800 -> 900, IDD40: 750 -> 810, IDD30: 700 -> 710 - ISB1 : 150 -> 200 Change PIN CAPACITANCE : CIN : 3.1 -> 3.2, COUT : 4 -> 4.2 Change AC TIMING CHARACTERISTICS - MIN tKHKL, tKHKL : -40 : 1.1 -> 1.2, -30 : 1.1 -> 1.4 - MIN tAVKH, tBVKH, tKHAX, tKHBX : -45 : 0.25 -> 0.27 - tKXCV MIN/MAX : 0.8/2.3 -> 1.0/2.5 Change PACKAGE THERMAL CHARACTERISTICS DraftData Dec. 2002 Jan. 2003 Feb. 2003 |
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