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SP9840 Datasheet(PDF) 2 Page - Sipex Corporation |
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SP9840 Datasheet(HTML) 2 Page - Sipex Corporation |
2 / 10 page 258 ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. V DD to GND ...................................................................... -0.3V, +7V V INX to GND ............................................................................... VDD V REFL to GND ............................................................................. VDD V OUTX to GND ............................................................................ VDD Short Circuit I OUTX to GND ............................................ Continuous Digital Input & Output Voltage to GND ....................................... V DD Operating Temperature Range Commercial ............................................................... 0 °C to +70°C Extended Industrial ................................................. -40 °C to +85°C Maximum Junction Temperature (T J max) .......................... +150°C Storage Temperature ................................................. -65 ° to 150°C Lead Temperature (Soldering, 10 sec) ............................... +300 °C Package Power Dissipation .................................. (T J max - TA)/8JA Thermal Resistance 8 JA P-DIP .................................................................................. 57 °C/W SOIC-24 .............................................................................. 70 °C/W CAUTION: While all input and output pins have internal protection networks, these parts should be considered ESD (ElectroStatic Discharge) sensitive de- vices. Permanent damage may occur on unconnected devices subject to high en- ergy electrostatic fields. Unused devices must be stored in conductive foam or shunts. Personnel should be properly grounded prior to handling this device. The protective foam should be discharged to the destination socket before devices are removed. SPECIFICATIONS (V DD = +5V, All VINX= 0V, VREFL = 1.625V, TA = 25° C for commercial–grade parts; T MIN ≤ TA = T MAX for industrial–grade parts; specifications apply to all DAC's unless noted otherwise.) PARAMETER MIN. TYP. MAX. UNITS CONDITIONS SIGNAL INPUTS Input Voltage Range 0 3.25 V V DD = 4.75V, VREFL = 1.625V Input Resistance D = 2B H, Code Dependent SP9840 3.1 6.2 k Ω SP9843 1.55 3.1 k Ω Input Capacitance Note 1 SP9840 19 30 pF SP9843 38 60 pF V REFL Resistance 0.68 1.3 k Ω Note 1 and 2 V REFL Capacitance 190 250 pF Note 1 DIGITAL INPUTS Logic High 2.4 V Logic Low 0.8 V Input Current ±10 µA Input Capacitance 8 pF Input Coding Offset Binary Note 3 STATIC ACCURACY Resolution 8 Bits Integral Nonlinearity ±0.75 ±1.5 LSB Note 4 Differential Nonlinearity ±0.3 ±1 LSB Note 4 Half-Scale Output Voltage 1.600 1.625 1.650 V PR = LOW, V REFL = 1.625V Minimum Output Voltage 20 100 mV D=FF H; ISINK = 0.1mA Output Voltage Drift 25 µV/°C PR = LOW DYNAMIC PERFORMANCE Multiplying Gain Bandwidth 3 5 MHz V IN(X) = 100mVP–P + 1.625V dc Slew Rate Measured 10% to 90% Positive 3.0 7.9 V/ µs ∆V = 3.2V Negative –3.0 –8.3 V/ µs ∆V = –3.2V Total Harmonic Distortion 0.003 % V IN(X) = 3VP–P +1.625V dc, D=FFH; 1KHz, fLP=80KHz Output Settling Time 0.7 µs ±1 LSB Error Band Crosstalk 60 70 dB Note 5 Digital Feedthrough 6 nVs D = 0 H to FFH Wideband Noise 42.5 µVrms V OUT = 3.25V, 400Hz to 80kHz SINAD 89 dB V IN(X) = 3VP–P +1.625V dc, D=FFH; 1KHz, fLP=80KHz Digital Crosstalk 6 nVs Note 6 |
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