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HAL115UA-K Datasheet(PDF) 10 Page - Micronas |
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HAL115UA-K Datasheet(HTML) 10 Page - Micronas |
10 / 17 page HAL114 10 Micronas 4. Type Description 4.1. HAL 114 The HAL 114 is a unipolar switching sensor (see Fig. 4–1). The output turns low with the magnetic south pole on the branded side of the package and turns high if the mag- netic field is removed. The sensor does not respond to the magnetic north pole on the branded side. For correct functioning in the application, the sensor re- quires only the magnetic south pole on the branded side of the package. Magnetic Features: – switching type: unipolar – typical BON: 21.1 mT at room temperature – typical BOFF: 17.1 mT at room temperature – operates with static magnetic fields and dynamic mag- netic fields up to 20 kHz Applications The HAL 114 is the optimal sensor for applications with one magnetic polarity such as: – solid state switches, – contactless solution to replace micro switches, – position and end-point detection, and – rotating speed measurement. BHYS Output Voltage Fig. 4–1: Definition of magnetic switching points for the HAL 114 0BOFF BON VOL VO B Magnetic Characteristics at TJ = –40 °C to +140 °C, VDD = 4.5 V to 24 V, Typical Characteristics for VDD = 12 V Magnetic flux density values of switching points. Positive flux density values refer to the magnetic south pole at the branded side of the package. Parameter On point BON Off point BOFF Hysteresis BHYS Unit TJ Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. –40 °C 7.5 21.5 36 4.3 17.4 33.2 2.8 4.1 5 mT 25 °C 7 21.1 34 4 17.1 31.2 2.8 4 4.5 mT 100 °C 6.3 19.9 31.5 3.6 16.4 28.9 2.6 3.5 4 mT 140 °C 6.1 19.4 31.3 3.6 16.1 28.8 2.2 3.3 4 mT The hysteresis is the difference between the switching points BHYS = BON – BOFF The magnetic limits given above refer to parts in the original packaging. Mechanical stress on the hall sensitive areas on the chip surface may generate an additional magnetic offset, which can slightly change the magnetic switching points. This behavior is a physical phenomenon and not a malfunction of the sensor. Mechanical stress on the hall plates can be caused, for example, by overmoulding the plastic package or by wide range temperature changes like soldering or operating the parts at extreme temperatures. Please use a sensor of the HAL 5xx family if a robustness against mechanical stress is required. |
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