Stock No. 23383-C

10

The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.

NanoAmp Solutions, Inc.

N16L163WC2C

Advance Information

VFBGA Package

Dimensions (mm)

DE

e = 0.75

BALL

MATRIX

TYPE

SD

SE

J

K

8±0.10

10±0.10

0.375

0.375

2.125

2.375

FULL

SIDE VIEW

TOP VIEW

BOTTOM VIEW

E

D

A1 BALL PAD

CORNER (3)

1.00 MAX

0.23±0.05

0.15

0.05

Z

Z

1. 0.30±0.05 DIA.

1. DIMENSION IS MEASURED AT THE

MAXIMUM SOLDER BALL DIAMETER.

PARALLEL TO PRIMARY Z.

2. PRIMARY DATUM Z AND SEATING

PLANE ARE DEFINED BY THE

SPHERICAL CROWNS OF THE

SOLDER BALLS.

3. A1 BALL PAD CORNER I.D. TO BE

MARKED BY INK.

2. SEATING PLANE - Z

SD

SE

e

K TYP

J TYP

e

A1 BALL PAD

CORNER