CYStech Electronics Corp.

Spec. No. : C335SG

Issued Date : 2003.06.10

Revised Date :

Page No. : 4/4

BAS21SG

CYStek Product Specification

SOD-323 Dimension

*: Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.0630

0.0709

1.60

1.80

E

0.0060

-

0.15

-

B

0.0453

0.0531

1.15

1.35

H

0.0000

0.0040

0.00

0.10

C

0.0315

0.0394

0.80

1.00

J

0.0035

0.0070

0.089

0.177

D

0.0098

0.0157

0.25

0.40

K

0.0906

0.1063

2.30

2.70

2.Lead thickness specified per L/F drawing with solder plating.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: 42 Alloy ; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

D

A

H

J

K

C

E

B

1

2

Style: Pin 1.Cathode 2.Anode

2-Lead SOD-323 Plastic

Surface Mounted Package

CYStek Package Code: SG

Marking:

5 H

JS