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GS9060 Datasheet(PDF) 6 Page - Gennum Corporation |
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GS9060 Datasheet(HTML) 6 Page - Gennum Corporation |
6 / 9 page GO1525 Data Sheet 21969 - 8 July 2005 6 of 9 3.1 Reflow Conditions The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended soldering conditions are as follows: 3.2 Soldering Flux Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance. 3.3 Rework or Repair Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow soldering. 3.4 Endurance To Warp When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-2, the device will not be cracked or damaged. Figure 3-3: PCB Warp Preheating 150±10°C, 60 to 120 sec. Soldering Peak 260°C Over 200°C within 30 sec. VCO PCB MAX 2mm |
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Similar Description - GS9060 |
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