GO1525 Data Sheet

21969 - 8

July 2005

6 of 9

3.1 Reflow Conditions

The device will meet the data sheet specifications after completing the reflow

process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended

soldering conditions are as follows:

3.2 Soldering Flux

Do not use cleaning type flux. Washing the devices after using cleaning type flux

may damage inner parts and affect performance.

3.3 Rework or Repair

Rework or repair must only be done once. Do not reflow the device more than

twice; once for initial soldering and once for remounting after rework.

Do not vibrate the VCO during reflow soldering.

3.4 Endurance To Warp

When the device is soldered on a printed circuit board (dimension: 100mm x

100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-2, the

device will not be cracked or damaged.

Figure 3-3: PCB Warp

Preheating

150±10°C, 60 to 120 sec.

Soldering

Peak 260°C

Over 200°C within 30 sec.

VCO

PCB

MAX 2mm