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MX29F200CTMI-90G Datasheet(PDF) 8 Page - Macronix International

Part # MX29F200CTMI-90G
Description  2M-BIT [256Kx8/128Kx16] CMOS FLASH MEMORY
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Manufacturer  MCNIX [Macronix International]
Direct Link  http://www.macronix.com
Logo MCNIX - Macronix International

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P/N:PM1250
REV. 1.0 , DEC. 14, 2005
MX29F200C T/B
READ/RESET COMMAND
The read or reset operation is initiated by writing the read/
reset command sequence into the command register.
Microprocessor read cycles retrieve array data. The
device remains enabled for reads until the command
register contents are altered.
If program-fail or erase-fail happen, the write of F0H will
reset the device to abort the operation. A valid command
must then be written to place the device in the desired
state.
SILICON-ID-READ COMMAND
Flash memories are intended for use in applications
where the local CPU alters memory contents. As such,
manufacturer and device codes must be accessible
while the device resides in the target system. PROM
programmers typically access signature codes by rais-
ing A9 to a high voltage. However, multiplexing high
voltage onto address lines is not generally desired
system design practice.
The MX29F200C T/B contains a Silicon-ID-Read opera-
tion to supplement traditional PROM programming meth-
odology. The operation is initiated by writing the read
silicon ID command sequence into the command regis-
ter. Following the command write, a read cycle with
A1=VIL,A0=VIL retrieves the manufacturer code of C2H/
00C2H. A read cycle with A1=VIL, A0=VIH returns the
device code of 51H/2251H for MX29F200CT, 57H/2257H
for MX29F200CB.
SET-UP AUTOMATIC CHIP/SECTOR ERASE COM-
MANDS
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command 80H. Two more "unlock" write cycles
are then followed by the chip erase command 10H.
The Automatic Chip Erase does not require the device
to be entirely pre-programmed prior to executing the
Automatic Chip Erase. Upon executing the Automatic
Chip Erase, the device will automatically program and
verify the entire memory for an all-zero data pattern.
When the device is automatically verified to contain an
all-zero pattern, a self-timed chip erase and verify begin.
The erase and verify operations are completed when the
data on Q7 is "1" at which time the device returns to the
Read mode. The system does not require to provide
any control or timing during these operations.
When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array(no
erase-verified command is required).
If the Erase operation was unsuccessful, the data on Q5
is "1"(see Table 4), indicating an erase operation exceed
internal timing limit.
The automatic erase begins on the rising edge of the last
WE# pulse in the command sequence and terminates
when the data on Q7 is "1" and the data on Q6 stops
toggling for two consecutive read cycles, at which time
the device returns to the Read mode.
Pins
A0
A1
Q15~Q8 Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Code(Hex)
Code
Manufacture code
Word
VIL
VIL
00H
1100
0
0
1
0
00C2H
Byte
VIL
VIL
X
1100
0
0
1
0
C2H
Device code
Word
VIH
VIL
22H
0101
0
0
0
1
2251H
for MX29F200CT
Byte
VIH
VIL
X
0101
0
0
0
1
51H
Device code
Word
VIH
VIL
22H
0101
0
1
1
1
2257H
for MX29F200CB
Byte
VIH
VIL
X
0101
0
1
1
1
57H
Sector Portection
X
VIH
X
0000
0
0
0
1
01H(Protected)
Verification
X
VIH
X
0000
0
0
0
0
00H(Unprotected)
TABLE 3. EXPANDED SILICON ID CODE


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