Micropower, Ultrasensitive

Hall-Effect Switches

A3212

9

Allegro MicroSystems, Inc.

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Package EH, 6-Contact DFN

C

0.08

7X

C

SEATING

PLANE

6

2

1

A

A

Terminal #1 mark area

B

Exposed thermal pad (reference only, terminal #1

identifier appearance at supplier discretion)

For Reference Only, not for tooling use (reference DWG-2861;

reference JEDEC MO-229WCED, Type 1)

Dimensions in millimeters

Exact case and lead configuration at supplier discretion within limits shown

C

Reference land pattern layout;

All pads a minimum of 0.20 mm from all adjacent pads; adjust as

necessary to meet application process requirements and PCB layout

tolerances; when mounting on a multilayer PCB, thermal vias at the

exposed thermal pad land can improve thermal dissipation (reference

EIA/JEDEC Standard JESD51-5)

Hall Element (not to scale); U.S. customary dimensions controlling

Branding scale and appearance at supplier discretion

E

E

E

1

6

B

2

F

E

F

Active Area Depth, 0.32 mm NOM

1.00

3.70 1.25

0.50

0.95

0.30

1

6

G

G

PCB Layout Reference View

C

2.00 ±0.15

0.88

1.57

3.00 ±0.15

0.75 ±0.05

1.224 ±0.050

1.042

+0.100

–0.150

0.25 ±0.05

0.5 BSC

0.55 ±0.10

D

D

Coplanarity includes exposed thermal pad and terminals

Standard Branding Reference View

Y = Last two digits of year of manufacture

W = Week of manufacture

L = Lot number

N = Last two digits of device part number

YWW

LLL

NN

1