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LP3999ITL-1.9 Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LP3999ITL-1.9
Description  Low Noise 150mA Voltage Regulator for RF/Analog Applications
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LP3999ITL-1.9 Datasheet(HTML) 5 Page - National Semiconductor (TI)

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Electrical Characteristics (Continued)
Unless otherwise noted, V
EN = 1.5, VIN =VOUT(NOM) + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, CBP = 0.01 µF. Typical
values and limits appearing in normal type apply for T
J = 25˚C. Limits appearing in boldface type apply over the full tempera-
ture range for operation, −40 to +125˚C. (Notes 13, 14)
Symbol
Parameter
Conditions
Typical
Limit
Units
Min
Max
FULL V
OUT RANGE
I
Q
Quiescent Current
V
EN = 1.5V, IOUT =0mA
85
150
µA
V
EN = 1.5V, IOUT = 150 mA
140
200
V
EN = 0.4V
0.003
1.5
I
SC
Short Circuit Current Limit
450
mA
E
N
Output Noise Voltage ((Note 11)) BW = 10 Hz to 100 kHz,
V
IN = 4.2V, No Load
10
µVrms
BW = 10 Hz to 100 kHz,
V
IN = 4.2V, 1mA Load
30
T
SHUTDOWN
Thermal Shutdown
Temperature
160
˚C
Hysteresis
20
ENABLE CONTROL CHARACTERISTICS
I
EN
Maximum Input Current at
V
EN Input
V
EN = 0.0V and VIN = 6.0V
0.001
µA
V
IL
Low Input Threshold
0.4
V
V
IH
High Input Threshold
0.9
V
TIMING CHARACTERISTICS
T
ON
Turn On Time (Note 11)
To 95% Level (Note 12)
140
µs
Note 3: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 4: All voltages are with respect to the potential at the GND pin.
Note 5: For further information on these packages please refer to the following application notes;
AN-1112 Micro SMD Package Wafer Level Chip Scale Package.
Note 6: Internal Thermal shutdown circuitry protects the device from permanent damage.
Note 7: In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op)), the maximum power dissipation (PD(max)), and
the junction to ambient thermal resistance in the application (
θJA). This relationship is given by :-
T
A(max) =TJ(max-op) −(PD(max) x
θ
JA)
Note 8: Junction to ambient thermal resistance is highly dependant on the application and board layout. In applications where high thermal dissipation is possible,
special care must be paid to thermal issues in the board design.
Note 9: The human body is 100 pF discharge through 1.5 k
Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin.
Note 10: The device maintains the regulated output voltage without load.
Note 11: This electrical specification is guaranteed by design.
Note 12: Time from VEN = 0.9V to VOUT = 95% (VOUT(NOM))
Note 13: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production at TJ = 25˚C or correlated using
Statistical Quality Control methods. Operation over the temperature specification is guaranteed by correlating the electrical characteristics to process and
temperature variations and applying statistical process control.
Note 14: VOUT(NOM) is the stated output voltage option for the device.
Recommended Output Capacitor
Symbol
Parameter
Conditions
Typical
Limit
Units
Min
Max
C
OUT
Output Capacitor
Capacitance (Note 15)
1.0
0.70
µF
ESR
5
500
m
Note 15: The capacitor tolerance should be 30% or better over temperature. Recommended capacitor type is X7R however dependant on application X5R,Y5V and
Z5U can also be used.
www.national.com
5


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