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ACS1026T Datasheet(PDF) 9 Page - STMicroelectronics |
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ACS1026T Datasheet(HTML) 9 Page - STMicroelectronics |
9 / 11 page ACS102-6T 4 Package information 9/11 4.2 SO-8 Mechanical data Figure 18. SO-8 Footprint In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. REF. DIMENSIONS Millimetres Inches Min. Typ. Max. Min. Typ. Max. A 1.350 1.75 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.100 1.650 0.043 0.065 B 0.330 0.510 0.013 0.020 C 0.190 0.250 0.008 0.010 D 4.800 5.000 0.189 0.197 E 3.800 4.000 0.150 0.157 e 1.270 0.050 H 5.800 6.200 0.228 0.244 h 0.250 0.500 0.010 0.020 L 0.400 1.270 0.016 0.050 k0° 8° 0° 8° ddd 0.100 0.004 E D 8 4 1 5 H k h x 45° L C (Seating Plane) 0.25mm (Gage Plane) e A A2 B A1 ddd C 6.8 4.2 1.27 0.6 |
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