RF

In

RF

Out

1

2

3

4

5

6

Vd1

Vd2

Vg1

Vg2

0.970

(0.038)

1

2

3

4

5

6

0.483

(0.019)

0.881

(0.035)

0.362

(0.014)

0.795

(0.031)

1.620

(0.064)

0.394

(0.016)

0.0

0.0

0.605

(0.024)

10.0-13.0/20.0-26.0 GHz GaAs MMIC

Active Doubler

Mechanical Drawing

12DBL0409

Page 3 of 6

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©

2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

March 2005 - Rev 01-Mar-05

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 12DBL0409)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.115 +/- 0.010 (0.0045 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 0.974 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #3 (Vd2)

Bond Pad #4 (RF Out)

Bond Pad #5 (Vg2)

Bond Pad #6 (Vg1)

RF In

Vd1

Vd2

RF Out

Vg2

Vg1