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MS6853 Datasheet(PDF) 8 Page - MOSA ELECTRONICS

Part # MS6853
Description  Mono 1.9W / Stereo 300mW Power Amplifier Low Voltage Operation, Pop Noise Free
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Manufacturer  MOSA [MOSA ELECTRONICS]
Direct Link  http://www.mosanalog.com
Logo MOSA - MOSA ELECTRONICS

MS6853 Datasheet(HTML) 8 Page - MOSA ELECTRONICS

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MOSA
MS6853
Mono 1.9W / Stereo 300mW Power Amplifier
REV 1.1
8
www.mosanalog.com
APPLICATION INFORMATION
Basic application example
L-IN
MS6853
SHUTDOWN
VDD
R-IN
10
9
BTL OUT+
HP-IN
GND
BYPASS
R-OUT
20k
8
7
6
5
4
3
2
1
L-OUT/BTL OUT-
1uF
1uF
20k
V
DD
20k
R
L
100uF
1k
1uF
100uF
1k
1uF
Headphone Jack
20k
100k
100k
V
DD
V
DD
V
INR
V
INL
R
F
R
F
R
IN
R
IN
DC Gain = -RF / RIN = -1
Fig.1
A audio amplifier application circuit.
SE mode and BTL mode operation
As shown in block diagram and Fig.1, in the SE mode, the MS6853 operates as a high current output dual op amp.
Amplifier A1 and A3 are independent amplifiers with an externally configured gain of AV = - RF/RIN. Amplifier A2 is
shut down to a high output impedance state.
In BTL mode, A3 is shutdown to a high impedance state. The audio signal from the R-IN pin is directed to the inverting
input of A1. As a result, the L-IN and R-IN audio signals, VINL and VINR, are summed together at the input of A1. A2 is
then activated with a closed-loop gain of AV = -1 fixed by two internal resistors. The outputs of A1 and A2 are then
used to drive the mono bridged-tied load.
HP-IN operation
The ability of the MS6853 is easily switched between mono BTL and stereo SE modes. The mode is switched by
headphone control pin, HP-IN. A logic-high activates the SE mode when a set of headphone plugged into the system,
on the other hand, a logical-low to HP-IN activates the BTL mode when no headphones.
Thermal pad considerations
The thermal pad must be connected to ground. The package with thermal pad of the MS6853 requires special attention
on thermal design. The thermal pad on the bottom of the MS6853 should be soldered down to a copper pad on the
circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient. If the copper
plane is not on the top surface of the circuit board, 9 vias of 13 mil or smaller in diameter should be used to thermally
couple the thermal pad to the bottom plane. For good thermal conduction, the vias must be plated through and solder
filled.


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