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MS6853 Datasheet(PDF) 8 Page - MOSA ELECTRONICS |
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MS6853 Datasheet(HTML) 8 Page - MOSA ELECTRONICS |
8 / 12 page MOSA MS6853 Mono 1.9W / Stereo 300mW Power Amplifier REV 1.1 8 www.mosanalog.com APPLICATION INFORMATION Basic application example L-IN MS6853 SHUTDOWN VDD R-IN 10 9 BTL OUT+ HP-IN GND BYPASS R-OUT 20k 8 7 6 5 4 3 2 1 L-OUT/BTL OUT- 1uF 1uF 20k V DD 20k R L 8Ω 100uF 1k 1uF 100uF 1k 1uF Headphone Jack 20k 100k 100k V DD V DD V INR V INL R F R F R IN R IN DC Gain = -RF / RIN = -1 Fig.1 A audio amplifier application circuit. SE mode and BTL mode operation As shown in block diagram and Fig.1, in the SE mode, the MS6853 operates as a high current output dual op amp. Amplifier A1 and A3 are independent amplifiers with an externally configured gain of AV = - RF/RIN. Amplifier A2 is shut down to a high output impedance state. In BTL mode, A3 is shutdown to a high impedance state. The audio signal from the R-IN pin is directed to the inverting input of A1. As a result, the L-IN and R-IN audio signals, VINL and VINR, are summed together at the input of A1. A2 is then activated with a closed-loop gain of AV = -1 fixed by two internal resistors. The outputs of A1 and A2 are then used to drive the mono bridged-tied load. HP-IN operation The ability of the MS6853 is easily switched between mono BTL and stereo SE modes. The mode is switched by headphone control pin, HP-IN. A logic-high activates the SE mode when a set of headphone plugged into the system, on the other hand, a logical-low to HP-IN activates the BTL mode when no headphones. Thermal pad considerations The thermal pad must be connected to ground. The package with thermal pad of the MS6853 requires special attention on thermal design. The thermal pad on the bottom of the MS6853 should be soldered down to a copper pad on the circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient. If the copper plane is not on the top surface of the circuit board, 9 vias of 13 mil or smaller in diameter should be used to thermally couple the thermal pad to the bottom plane. For good thermal conduction, the vias must be plated through and solder filled. |
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