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G915 Datasheet(PDF) 2 Page - Global Mixed-mode Technology Inc |
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G915 Datasheet(HTML) 2 Page - Global Mixed-mode Technology Inc |
2 / 5 page Ver: 1.1 Aug 04, 2004 TEL: 886-3-5788833 http://www.gmt.com.tw 2 G915 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage……………………………………………7V Power Dissipation Internally Limited (Note2) Maximum Junction Temperature.........................150°C Storage Temperature Range.........-65°C ≤ TJ ≤+150°C Reflow Temperature (soldering, 10sec)............260°C Continuous Power Dissipation (TA = + 25°C) SOT89(1)...............................................................0.5W Thermal Resistance Junction to Case SOT89……………………………………………...55°C/W Note (1): See Recommended Minimum Footprint. Operating Conditions (Note 1) Input Voltage..................................................2.9V ~ 6V Temperature Range...........................-40°C ≤ TA ≤85°C Electrical Characteristics VIN =2.5V, IO =500mA, CIN=10µF, COUT =10µF. All specifications apply for TA =TJ =25°C. [Note 3] PARAMETER CONDITION MIN TYP MAX UNIT Input Voltage 2.9 --- 6 V Output Voltage 5mA < IO < 600mA --- 1.5 --- V Line Regulation 4V < VIN < 6V, IO = 10mA --- 10 --- mV Load Regulation 10mA < IO < 600mA --- 10 --- mV Quiescent Current VIN = 5V --- 0.3 --- mA Ripple Rejection fi = 120 Hz, 1VP-P, IO = 100mA --- 50 --- dB Short Circuit Current --- 0.65 --- A Current Limit --- 0.8 --- A Over Temperature --- 145 --- °C Over Temperature Hysterics --- 25 --- °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaran- teed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal re- sistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem- perature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G915 in the SOT89 package is 250°C/W (See Recommended Minimum Footprint). The safe operation in SOT 89 package, it can see “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as pos- sible. Note4: The type of output capacitor should be tantalum, aluminum or ceramic. Definitions Dropout Voltage The input/output Voltage differential at which the regu- lator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load cur- rent and minimum input supply requirements. Line Regulation The change in output voltage for a change in input volt- age. The measurement is made under conditions of low dissipation or by using pulse techniques such that av- erage chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measure- ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem- perature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. |
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