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G9131-33T22U Datasheet(PDF) 7 Page - Global Mixed-mode Technology Inc |
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G9131-33T22U Datasheet(HTML) 7 Page - Global Mixed-mode Technology Inc |
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7 / 10 page  Ver: 1.6 Dec 22, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 7 G9131 Global Mixed-mode Technology Inc. Pin Description NAME FUNCTION IN Regulator Input. Supply voltage can range from VIN(min) to +5.5V. Bypass with 1µF to GND. GND This is ground pin. OUT Regulator Output. Sources up to 300mA. Bypass with a 1µF, ＜0.2 Ω typical ESR capacitor to GND. Detailed Description The block diagram of the G9131 is shown in Figure 1. It consists of an error amplifier, 1.25V bandgap refer- ence, PMOS output transistor, internal feedback volt- age divider, over current protection circuit, and over temperature protection circuit. Over Current Protection The G9131 use a current sense-resistor to monitor the output current. A portion of the PMOS output transistor’s current is mirrored to a resistor such that the voltage across this resistor is proportional to the output current. Once the output current exceeds limit threshold, G9131 would be protected with a limited output current. Further more, when the output is short to ground, the output current would be folded-back to a less limit. Over Temperature Protection To prevent abnormal temperature from occurring, the G9131 has a built-in temperature monitoring circuit. When it detects the temperature is above 150°C, the output transistor is turned off. When the IC is cooled down to below 135°C, the output is turned on again. In this way, the G9131 will be protected against abnor- mal junction temperature during operation. Operating Region and Power Dissipation Since the G9131 is a linear regulator, its power dissi- pation is always given by P = IOUT (VIN - VOUT). The maximum power dissipation is given by: PD(MAX) = (TJ - TA)/θJA, Where (TJ - TA) is the temperature difference the G9131 die and the ambient air. For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. θJA is the thermal resistance of the chosen package to the ambient air. In the case of a SOT-23 package, the thermal resistance is typically 275.5°C/W. In SOT 89 RθJA is 172.5°C/W. |
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