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73M2901-32I3 Datasheet(PDF) 1 Page - TDK Electronics |
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73M2901-32I3 Datasheet(HTML) 1 Page - TDK Electronics |
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1 / 17 page  73M2901/3.3V Advanced Single Chip Modem DESCRIPTION The 73M2901/3.3V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprietary multiply and accumulate (MAC) coprocessor; Sigma- Delta A/D and D/A converters; and an analog front end. The ROM and RAM necessary to operate the modem are contained on the device. Additionally, the 73M2901/3.3V provides an on-chip oscillator and Hybrid driver. The 73M2901/3.3V is a high performance, low voltage, low power, single chip modem capable of data transmission and reception through 2400bps. The 73M2901/3.3V is intended for embedded applications and battery operation. This device offers low power 3.3 volt design with optional internal hybrid and country specific call progress support. FEATURES • Low overall system chip count. True one chip solution for embedded systems • Low operating power (~120mW @ 3.3V, automatic low power standby and power down options available) • Internal ROM and RAM for normal operation • On chip optional hybrid driver • Designed for +3.15 through +3.6 volts • Data speeds: V.22bis – 2400bps V.22, Bell 212 – 1200bps V.21, Bell 103 – 300bps V.23 – 1200/75bps (w/ turnaround (PAVI)) Bell 202 – 1200bps Bell 202 and V23 4-wire operations • Dynamic Range: -9dBm to –43 dBm • “AT” command set • Host access to modem port pins via AT commands for custom I/O expansion • DTMF tone generation and detection • Call progress support with multinational options (FCC68, CTR21, JATE…) • Caller ID capability • Blacklisting capability • Packaging: 32 pin PLCC or 44 pin TQFP BLOCK DIAGRAM ROM MAC RAM CPU AFE Hybrid RxA TxAP TxAP HBDEN TxCLK ASRCH RING DTR RI CTS DCD DSR RTS RxCLK TxD RxD USR10 USR11 RELAY December 2000 |
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