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IC42S16100-5TG Datasheet(PDF) 6 Page - Integrated Circuit Solution Inc

Part # IC42S16100-5TG
Description  512K x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM
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Manufacturer  ICSI [Integrated Circuit Solution Inc]
Direct Link  http://www.icsi.com.tw
Logo ICSI - Integrated Circuit Solution Inc

IC42S16100-5TG Datasheet(HTML) 6 Page - Integrated Circuit Solution Inc

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IC42S16100
6
Integrated Circuit Solution Inc.
DR024-0D 06/25/2004
DC ELECTRICAL CHARACTERISTICS (Recommended Operation Conditions unless otherwise noted.)
Symbol Parameter
Test Condition
Speed Min.
Max.
Unit
IIL
Input Leakage Current
0V
≤ VIN ≤ VCC, with pins other than
–5
5
µA
the tested pin at 0V
IOL
Output Leakage Current
Output is disabled
–10
10
µA
0V
≤ VOUT ≤ VCC
VOH
Output High Voltage Level
IOUT = –2 mA
2.4
V
VOL
Output Low Voltage Level
IOUT = +2 mA
0.4
V
ICC1
Operating Current(1,2)
One Bank Operation,
CAS latency = 3
-5
150
mA
Burst Length=1
-6
145
mA
tRC
≥ tRC (min.)
-7
140
mA
IOUT = 0mA
ICC2
Precharge Standby Current
CKE
≤ VIL (MAX)tCK = tCK (MIN)—
2
mA
(In Power-Down Mode)
ICC3
Active Standby Current
CKE
≥ VIH (MIN)tCK = tCK (MIN)—
—5
50
mA
(In Non Power-Down Mode)
—6
45
mA
——7
40
mA
ICC4
Operating Current
tCK = tCK (MIN)
-5
150
mA
(In Burst Mode)(1)
IOUT = 0mA
-6
140
mA
-7
130
mA
ICC5
Auto-Refresh Current
tRC = tRC (MIN)
-5
100
mA
-6
90
mA
-7
80
mA
ICC6
Self-Refresh Current
CKE
≤ 0.2V
1
mA
Notes:
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time
increases. Also note that a bypass capacitor of at least 0.01 µF should be inserted between Vcc and GND for each
memory chip to suppress power supply voltage noise (voltage drops) due to these transient currents.
2. Icc1 and Icc4 depend on the output load.


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