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HD404392FP Datasheet(PDF) 9 Page - Hitachi Semiconductor |
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HD404392FP Datasheet(HTML) 9 Page - Hitachi Semiconductor |
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9 / 100 page  HD404344R Series/HD404394 Series 9 Bonding Pad Coordinates HCD404344R, HCD40C4344R Type Code Chip size (X × Y): 3.23 × 3.65 (mm) Coordinates: Pad center Home point position: Chip center Pad size (X × Y): 90 × 90 (µm) Chip thickness: 400 ( µm) Chip center (X=0, Y=0) Pad Coordinates Pad Coordinates No. Pad Name X ( µm) Y ( µm) No. Pad Name X ( µm) Y ( µm) 1 R13 –1425 1370 16 TEST 1360 –1627 2 R20 –1425 1050 17 RESET 1418 –1456 3 R21 –1425 732 18 R00 1418 –1072 4 R22 –1425 455 19 R01 1418 –690 5 R23 –1425 165 20 R02 1418 –306 6 OSC1 –1425 –115 21 R03 1418 312 7 OSC2 –1425 –732 22 D0 1418 694 8 GND –1425 –997 23 D1 1418 1098 9 GND –1425 –1244 24 D2 1418 1501 10 R30 –1257 –1627 25 D3 1075 1627 11 R31 –891 –1627 26 D4 693 1627 12 R32 –526 –1627 27 D5 309 1627 13 R33 –162 –1627 28 R10 –329 1627 14 V CC 420 –1627 29 R11 –732 1627 15 V CC 804 –1627 30 R12 –1135 1627 |
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