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ADC14155 Datasheet(PDF) 9 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # ADC14155
Description  14-Bit, 155 MSPS, 1.1 GHz Bandwidth A/D Converter
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

ADC14155 Datasheet(HTML) 9 Page - National Semiconductor (TI)

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Timing and AC Characteristics
Unless otherwise specified, the following specifications apply: AGND = DGND = DRGND = 0V, V
A =VD = +3.3V, VDR = +1.8V,
Internal V
REF = +1.0V, fCLK = 155 MHz, VCM =VRM,tr =tf = TBD ns, CL = 5 pF/pin, Differential Clock Mode, Offset Binary For-
mat. Typical values are for T
A = 25˚C. Timing measurements are taken at 50% of the signal amplitude. Boldface limits apply
for T
MIN
≤ T
A
≤ T
MAX. All other limits apply for TA = 25˚C (Notes 6, 7, 8)
Parameter
Conditions
Typical
(Note 9)
Limits
(Note 9)
Units
(Limits)
Maximum Clock Frequency
155
MHz (max)
Minimum Clock Frequency
5
MHz (min)
Clock High Time
TBD
ns (min)
Clock Low Time
TBD
ns (min)
Conversion Latency
8
Clock
Cycles
Output Delay of CLK to DATA
Relative to falling edge of CLK
2.0
TBD
ns (max)
Data Output Setup Time
Relative to DRDY
2.1
1.5
ns (min)
Data Output Hold Time
Relative to DRDY
2.1
1.5
ns (min)
Aperture Delay
TBD
ns
Aperture Jitter
0.08
ps rms
Power Down Recovery Time
0.1 µF on pins 43, 44; 10 µF and 0.1 µF
between pins 43, 44; 0.1 µF and 10 µF
on pins 46, 46
3ms
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the
listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.
Note 2: All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to 5 mA. The
TBD mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to TBD.
Note 4: The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient temperature, (TA), and
can be calculated using the formula PD,max =(TJ,max -TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is
operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such
conditions should always be avoided.
Note 5: Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 6: The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per
(Note 3). However, errors in the A/D conversion can occur if the input goes above 2.6V or below GND as described in the Operating Ratings section.
20179011
Note 7: To guarantee accuracy, it is required that |VA–VD| ≤ 100 mV and
separate bypass capacitors are used at each power supply pin.
Note 8: With the test condition for VREF = +1.0V (2VP-P differential input),
the 14-bit LSB is 122.1 µV.
Note 9: Typical figures are at TA = 25˚C and represent most likely parametric
norms at the time of product characterization. The typical specifications are
not guaranteed.
Note 10: Integral Non Linearity is defined as the deviation of the analog
value, expressed in LSBs, from the straight line that passes through positive
and negative full-scale.
Note 11: The input capacitance is the sum of the package/pin capacitance
and the sample and hold circuit capacitance.
Note 12: Optimum performance will be obtained by keeping the reference
input in the 0.9V to 1.1V range. The LM4051CIM3-ADJ (SOT-23 package) is
recommended for external reference applications.
Note 13: IDR is the current consumed by the switching of the output drivers
and is primarily determined by load capacitance on the output pins, the
supply voltage, VDR, and the rate at which the outputs are switching (which is
signal dependent). IDR=VDR(C0 xf0 +C1 xf1 +....C11 xf11) where VDR is the
output driver power supply voltage, Cn is total capacitance on the output pin,
and fn is the average frequency at which that pin is toggling.
www.national.com
9


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