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ADC14155 Datasheet(PDF) 9 Page - National Semiconductor (TI) |
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ADC14155 Datasheet(HTML) 9 Page - National Semiconductor (TI) |
9 / 19 page Timing and AC Characteristics Unless otherwise specified, the following specifications apply: AGND = DGND = DRGND = 0V, V A =VD = +3.3V, VDR = +1.8V, Internal V REF = +1.0V, fCLK = 155 MHz, VCM =VRM,tr =tf = TBD ns, CL = 5 pF/pin, Differential Clock Mode, Offset Binary For- mat. Typical values are for T A = 25˚C. Timing measurements are taken at 50% of the signal amplitude. Boldface limits apply for T MIN ≤ T A ≤ T MAX. All other limits apply for TA = 25˚C (Notes 6, 7, 8) Parameter Conditions Typical (Note 9) Limits (Note 9) Units (Limits) Maximum Clock Frequency 155 MHz (max) Minimum Clock Frequency 5 MHz (min) Clock High Time TBD ns (min) Clock Low Time TBD ns (min) Conversion Latency 8 Clock Cycles Output Delay of CLK to DATA Relative to falling edge of CLK 2.0 TBD ns (max) Data Output Setup Time Relative to DRDY 2.1 1.5 ns (min) Data Output Hold Time Relative to DRDY 2.1 1.5 ns (min) Aperture Delay TBD ns Aperture Jitter 0.08 ps rms Power Down Recovery Time 0.1 µF on pins 43, 44; 10 µF and 0.1 µF between pins 43, 44; 0.1 µF and 10 µF on pins 46, 46 3ms Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. Note 2: All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified. Note 3: When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to 5 mA. The TBD mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to TBD. Note 4: The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient temperature, (TA), and can be calculated using the formula PD,max =(TJ,max -TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided. Note 5: Reflow temperature profiles are different for lead-free and non-lead-free packages. Note 6: The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per (Note 3). However, errors in the A/D conversion can occur if the input goes above 2.6V or below GND as described in the Operating Ratings section. 20179011 Note 7: To guarantee accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. Note 8: With the test condition for VREF = +1.0V (2VP-P differential input), the 14-bit LSB is 122.1 µV. Note 9: Typical figures are at TA = 25˚C and represent most likely parametric norms at the time of product characterization. The typical specifications are not guaranteed. Note 10: Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive and negative full-scale. Note 11: The input capacitance is the sum of the package/pin capacitance and the sample and hold circuit capacitance. Note 12: Optimum performance will be obtained by keeping the reference input in the 0.9V to 1.1V range. The LM4051CIM3-ADJ (SOT-23 package) is recommended for external reference applications. Note 13: IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 xf0 +C1 xf1 +....C11 xf11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at which that pin is toggling. www.national.com 9 |
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