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APL5312-27BI-TR Datasheet(PDF) 10 Page - Anpec Electronics Coropration |
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APL5312-27BI-TR Datasheet(HTML) 10 Page - Anpec Electronics Coropration |
10 / 15 page Copyright © ANPEC Electronics Corp. Rev. A.1 - Sep., 2005 APL5312 www.anpec.com.tw 10 techniques (see the Figure Output Noise vs. BP Capacitance). Shutdown The APL5312 has an active high enable function. Force SHDN high (>1.6V) enables the V OUT, SHDN low (<0.4V) disables the V OUT. Enter the shutdown mode, it also causes the output voltage to discharge through a 500 Ω resistance to ground. In shutdown mode, the quiescent current can reduce to 0.1uA. The SHDN pin cannot be floating, a floating SHDN pin may cause an indeterminate state on the output. If it is no use, connect to V IN for normal operation. Input-Output (Dropout) Voltage The minimum input-output voltage differential (dropout) determines the lowest usable supply voltage. The dropout voltage is a function of drain-to-source on resistance multiplied by the load current. Current Limit APL5312 includes a current-limit circuitry for linear regulator. The current limit protection, which sense the current flows the P-channel MOSFET, and con- trols the output voltage. The point where limiting oc- curs is I OUT = 500mA . The output can be shorted to ground for an indefinite amount of time without damaging to the part. Thermal Protection Thermal protection limits total power dissipation in the APL5312. When the junction temperature exceeds T J = +160°C, the thermal sensor generate a logic sig- nal to turn off the pass element and let IC to cool. When the IC’s junction temperature cools by 20 °C, the thermal sensor will turn the pass element on again, resulting in a pulsed output during continuous thermal Noise, PSRR, and Load-Transient Response (Cont.) protection. Thermal protection is designed to protect the IC in the event of fault conditions. Operating Region and Power Dissipation The thermal resistance of the case and circuit board, ambient and junction air temperature, and the rate of air flow all control the APL5312’s maximum power dissipation. The power dissipation across the device is P = I OUT (VIN-VOUT). The maximum power dissipation is: P MAX = (TJ - TA) / (θJC + θCA ) θ JA = θJC + θCA where T J - TA is the temperature difference between the junction and ambient air. θ JC is the thermal resistance of the package, θCA is the thermal resistance through the printed circuit board, copper traces, and other materials to the surrounding air, θ JA = is the thermal resistance between Junction and ambient air. For continual operation, do not exceed the absolute maximum junction Temperature rating of T J = 125°C. For example: The SOT23-5 package has maximum power dissipation 300mW at T A= 55°C, relatively 225mW at SC70-5 package (see the Figure Maximum Power Dissipation vs. Ambient Temperature). V IN = 5V, IOUT = 250mA, VOUT = 3.3V, P D = (5-3.3)V x 150mA = 255mW According the power dissipation issue, we should adapt the SOT23-5 package. It could reduce the thermal resistance to maintain the IC longer life. The GND pin provides an electrical connection to ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air. Application Information (Cont.) |
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