Copyright  ANPEC Electronics Corp.

Rev. B.2 - Mar., 2005

www.anpec.com.tw

10

APM3011NU

Test item

Method

Description

SOLDERABILITY

MIL-STD-883D-2003

245°C,5 SEC

HOLT

MIL-STD 883D-1005.7

1000 Hrs Bias @ 125°C

PCT

JESD-22-B, A102

168 Hrs, 100% RH, 121°C

TST

MIL-STD 883D-1011.9

-65°C ~ 150°C, 200 Cycles

Carrier Tape & Reel Dimensions

t

Ao

E

W

Po

P

Ko

Bo

D1

D

F

P1

Reliability Test Program

Table 2. Pb-free Process – Package Classification Reflow Tem peratures

Package Thickness

Volum e m m

3

<350

Volum e m m

3

350-2000

Volum e m m

3

>2000

<1.6 m m

260 +0

°C*

260 +0

°C*

260 +0

°C*

1.6 m m – 2.5 m m

260 +0

°C*

250 +0

°C*

245 +0

°C*

≥2.5 mm

250 +0

°C*

245 +0

°C*

245 +0

°C*

*Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and

including the stated classification tem perature (this m eans Peak reflow tem perature +0

°C.

For exam ple 260

°C+0°C) at the rated MSL level.

Table 1.

SnPb Entectic Process – Package Peak R eflow Tem peratures

Package Thickness

Volum e m m

3

<350

Volume mm

3

≥350

<2.5 m m

240 +0/-5

°C

225 +0/-5

°C

≥2.5 m m

225 +0/-5

°C

225 +0/-5

°C

Classification Reflow Profiles(Cont.)