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APV2002KI-W Datasheet(PDF) 5 Page - Anpec Electronics Coropration |
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APV2002KI-W Datasheet(HTML) 5 Page - Anpec Electronics Coropration |
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5 / 9 page  Copyright ANPEC Electronics Corp. Rev. A.3 - Nov., 2002 APV2002 www.anpec.com.tw 5 2 1 3 4 5 6 11 10 7 8 9 (0 ,0 ) x Y Pad Center Pad # Symbol X(um) Y(um) 1 XTB 260 743 2 OEPAD 78 700 3 S0PAD 78 531 4 S1PAD 78 359 5 GND 225,321 78,78 6 TCBPAD 468 78 7 QO 638 163 8 NC 638 356 9 VDD 638,638 457,553 10 OEPAD 638 700 11 XT 449 743 Note7 : Substrate should be connected to GND. Note8 : VDD and GND are double pads. Die Size = 716.5um * 821.5um Pad Size = 86um * 86um Die Thickness = 250um Pad Position |
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