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TSPC603R Datasheet(PDF) 7 Page - ATMEL Corporation |
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TSPC603R Datasheet(HTML) 7 Page - ATMEL Corporation |
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7 / 58 page  7 5410B–HIREL–09/05 TSPC603R 8. Thermal Characteristics 8.1 CBGA 255 and CI-CGA 255 Packages The data found in this section concerns 603R devices packaged in the 255-lead 21 mm multi-layer ceramic (MLC) and ceramic BGA package. Data is included for use with a Thermal- loy #2328B heat sink. The internal thermal resistance for this package is negligible due to the exposed die design. A thermal interface material is recommended at the package lid to heat sink interface to minimize the thermal contact resistance. Additionally, the CBGA package offers an excellent thermal connection to the card and power planes. Heat generated at the chip is dissipated through the package, the heat sink (when used) and the card. The parallel heat flow paths result in the lowest overall thermal resistance as well as offer significantly better power dissipation capability if a heat sink is not used. The thermal characteristics for the flip-chip CBGA and CI-CGA packages are as follows: Thermal resistance (junction-to-case) = R jc or θ jc = 0.095°C/Watt for the 2 packages. Thermal resistance (junction-to-ball) = R jb or θ jb = 3.5°C/Watt for the CBGA package. Thermal resistance (junction-to-bottom SCI) = R js or θ js = 3.7°C/Watt for the CI-CGA package. The junction temperature can be calculated from the junction to ambient thermal resistance, as follow: Junction temperature: T j = Ta + (Rjc + Rcs + Rsa) × P where: T a is the ambient temperature in the vicinity of the device R jc is the die junction to case thermal resistance of the device R cs is the case to heat sink thermal resistance of the interface material R sa is the heat sink to ambient thermal resistance P is the power dissipated by the device During operation, the die-junction temperatures (T j) should be maintained at a lower value than the value specified in ”Recommended Operating Conditions” on page 6. The thermal resistance of the thermal interface material (R cs) is typically about 1°C/Watt. Assuming a T a of 85°C and a consumption (P) of 3.6 Watts, the junction temperature of the device would be as follow: T j = 85°C + (0.095°C/Watt + 1°C/Watt + Rsa) × 3.5 Watts. For the Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (R sa) versus airflow velocity is shown in Figure 8-1. |
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