Surface Mount Monolithic Integrated PIN Diode Chip:

0604 Unconnected Double Tee

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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Visit www.macom.com for additional data sheets and product information.

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MADP-064908-131000

Assembly Guidelines

Handling

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and

skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual

components. Bulk handling should insure that abrasion and mechanical shock are minimized.

Bonding

Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are

conveniently located on the bottom surface of these devices and are removed from the active junction locations.

These devices are well suited for solder attachment onto hard and soft substrates. The use of

80 Au / 20 Sn or Sn 60 / Pb 40 solder is recommended. Conductive silver epoxy for die attachment, approximately

2 mils in uniform thickness may also be used for lower Incident power applications ( < 1 W Average Power ).

When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a

vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft

substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so

that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the

circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of

the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder

reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass

is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die

after attach is completed.

A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” ,

“ Surface Mounting Instructions “ on the MA-COM website www.macom.com